Micro- and nano-fabrication is done using three available lithography systems:

• Raith eLine plus electron beam lithography
• DMO DLP baby 3+ projection lithography
• Measline UV mask aligner

Mix-match process typically on Si wafer is used to optimize for size (down to tens of nanometrs) and speed of the exposure. Several lithography resist (positive and negative-tone) are optimized and frequently used. Professional wet-bench with spin-coating, ultrasonic bath and hot-plate is available.

Two etching methods are used. Dry etching using ion-beam milling is optimized in Microsystems IonSys 500 tool, enabling atomic-resolution etching depth control using mass spectrometer analyzer. System enables rotation and tilt angle adjustment during etching. Wet etching of selected materials is possible.